| Industry | C39计算机、通信和其他电子设备制造业 |
| Market Segment | Main Board |
| Currency | CNY |
| Fiscal Year | 2024 |
JCET Group Co., Ltd., together with its subsidiaries, provides integrated-circuit manufacturing and technology services in China and internationally. The company offers semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipment solutions; wirebond packaging, flip chip packaging, wafer bumping, wafer level packaging, system-in-package, MEMS and sensors packaging, power device packaging, and fan-in and out wafer-level packaging. It also provides design and characterization, test platforms, and engineering services. The company's products a...
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About 长电科技
JCET Group Co., Ltd., together with its subsidiaries, provides integrated-circuit manufacturing and technology services in China and internationally. The company offers semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipment solutions; wirebond packaging, flip chip packaging, wafer bumping, wafer level packaging, system-in-package, MEMS and sensors packaging, power device packaging, and fan-in and out wafer-level packaging. It also provides design and characterization, test platforms, and engineering services. The company's products are used in automotive, computing, storage, edge AI, and power and energy sector. The company was formerly known as Jiangsu Changjiang Electronics Technology Co., Ltd. and changed its name to JCET Group Co., Ltd. in November 2019. JCET Group Co., Ltd. was founded in 1972 and is based in Jiangyin, China.
| Ticker | 600584 |
| Exchange | SSE |
| Sector | 证监会行业分类 |
| Industry | C39计算机、通信和其他电子设备制造业 |