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Key Metrics
Market Cap
8.4B ($1.2B)
P/E Ratio
N/A
P/B Ratio
N/A
Revenue
1.2B
Net Income
97.5M
Gross Margin
N/A
Op. Margin
8.9%
Net Margin
8.4%
ROE
4.2%
ROA
3.3%
D/E
0.29
Dividend Yield
N/A
EPS
0.69
Current Ratio
3.20
Price History
Company Info
IndustryC39计算机、通信和其他电子设备制造业
Market SegmentSTAR Market
CurrencyCNY
Fiscal Year2024
Business Overview

Darbond Technology Co., Ltd engages in the research and development, production, and sale of polymer engineering and interface materials in China. The company offers integrated circuit packaging, thermal conducting interface, high end equipment application, and new energy application materials products. It also offers solutions, including integrated circuit solutions panel display solutions, intelligent device and power battery solutions. The company also engages in the research and development, manufacturing, and sale of thermal conductive interface materials. Darbond Technology Co., Ltd was ...

Peers
工商银行
601398
2.7T
P/E: 7.6
建设银行
601939
2.5T
P/E: 7.2
农业银行
601288
2.4T
P/E: 8.7
中国海油
600938
2.0T
P/E: 16.2
宁德时代
300750
1.9T
P/E: 25.6
贵州茅台
600519
1.8T
P/E: 20.1
中国银行
601988
1.8T
P/E: 7.3
中国人寿
601628
1.2T
P/E: 6.9
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About 德邦科技

Darbond Technology Co., Ltd engages in the research and development, production, and sale of polymer engineering and interface materials in China. The company offers integrated circuit packaging, thermal conducting interface, high end equipment application, and new energy application materials products. It also offers solutions, including integrated circuit solutions panel display solutions, intelligent device and power battery solutions. The company also engages in the research and development, manufacturing, and sale of thermal conductive interface materials. Darbond Technology Co., Ltd was founded in 2003 and is headquartered in Yantai, China.


Ticker688035
ExchangeSSE
Sector证监会行业分类
IndustryC39计算机、通信和其他电子设备制造业
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