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芯源微

芯源微
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Price History
Market Data
Market Cap33.3B
Market Cap (USD)$4.6B
P/E Ratio-
P/B Ratio-
EPS1.01
Dividend Yield-
D/E Ratio0.98
Current Ratio2.70
Market SegmentSTAR Market
CurrencyCNY
Business Overview

KINGSEMI Co., Ltd. engages in the research and development, production, sales, and service provision of semiconductor fabrication equipment in China and internationally. It offers spin coater/developer, spray coater, scrubber, wet etcher, photolithography process coating and developing equipment, single-wafer cleaner, debonding machines, and other products, which are used in semiconductor production, packaging, MEMS, LED, OLED, 3D-IC TSV, PV, and other fields. The company was founded in 2002 and is headquartered in Shenyang, China.

证监会行业分类 C35专用设备制造业 SSE
Key Financial Metrics
1.8B
Revenue
201.0M
Net Income
1.01
EPS (Diluted)
218.0M
Free Cash Flow
Profitability
Gross Margin -
Operating Margin 12.7%
Net Profit Margin 11.5%
EBITDA 222.0M
Returns & Efficiency
Return on Assets (ROA) 3.6%
Return on Equity (ROE) 7.1%
Dividend Yield -
EPS 1.01
Financial Health
Total Assets 5.6B
Total Debt 2.8B
Debt to Equity 0.98x
Current Ratio 2.70
Company Info
IndustryC35专用设备制造业
Market SegmentSTAR Market
CurrencyCNY
Fiscal Year2024
Peers
2.7T
P/E: 7.6
2.5T
P/E: 7.2
2.4T
P/E: 8.7
CNOOC LIMITED
600938
2.0T
P/E: 16.2
1.9T
P/E: 25.6
1.8T
P/E: 20.1
1.8T
P/E: 7.3
1.2T
P/E: 6.9
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Company Profile
General Information
Company Name芯源微
Ticker688037
ExchangeSSE
Sector证监会行业分类
IndustryC35专用设备制造业
Market SegmentSTAR Market
Fiscal Year2024
CurrencyCNY
Financial Summary
Market Cap33.3B
Market Cap (USD)$4.6B
Revenue1.8B
Net Income201.0M
P/E Ratio-
EPS1.01
Net Margin11.5%
ROE7.1%
Dividend Yield-
Description

KINGSEMI Co., Ltd. engages in the research and development, production, sales, and service provision of semiconductor fabrication equipment in China and internationally. It offers spin coater/developer, spray coater, scrubber, wet etcher, photolithography process coating and developing equipment, single-wafer cleaner, debonding machines, and other products, which are used in semiconductor production, packaging, MEMS, LED, OLED, 3D-IC TSV, PV, and other fields. The company was founded in 2002 and is headquartered in Shenyang, China.

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