| Industry | C39计算机、通信和其他电子设备制造业 |
| Market Segment | STAR Market |
| Currency | CNY |
| Fiscal Year | 2025 |
Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for display driver chips in China. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, electronic tags, and other categories. The company was founded in 2015 and is headquartered in Hefei, China.
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About 汇成股份
Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for display driver chips in China. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, electronic tags, and other categories. The company was founded in 2015 and is headquartered in Hefei, China.
| Ticker | 688403 |
| Exchange | SSE |
| Sector | 证监会行业分类 |
| Industry | C39计算机、通信和其他电子设备制造业 |