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Key Metrics
Market Cap
13.0B ($1.9B)
P/E Ratio
N/A
P/B Ratio
N/A
Revenue
1.8B
Net Income
155.0M
Gross Margin
N/A
Op. Margin
9.0%
Net Margin
8.7%
ROE
4.4%
ROA
3.2%
D/E
0.37
Dividend Yield
N/A
EPS
0.18
Current Ratio
5.36
Price History
Company Info
IndustryC39计算机、通信和其他电子设备制造业
Market SegmentSTAR Market
CurrencyCNY
Fiscal Year2025
Business Overview

Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for display driver chips in China. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, electronic tags, and other categories. The company was founded in 2015 and is headquartered in Hefei, China.

Peers
工商银行
601398
2.7T
P/E: 7.6
建设银行
601939
2.5T
P/E: 7.2
农业银行
601288
2.4T
P/E: 8.7
中国海油
600938
2.0T
P/E: 16.2
宁德时代
300750
1.9T
P/E: 25.6
贵州茅台
600519
1.8T
P/E: 20.1
中国银行
601988
1.8T
P/E: 7.3
中国人寿
601628
1.2T
P/E: 6.9
Financial Statements
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About 汇成股份

Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for display driver chips in China. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, electronic tags, and other categories. The company was founded in 2015 and is headquartered in Hefei, China.


Ticker688403
ExchangeSSE
Sector证监会行业分类
IndustryC39计算机、通信和其他电子设备制造业
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